NTD3055L104【PDF 1/9 页】MOSFET N-CH 60V 12A DPAK

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NTD3055L104,

NTDV3055L104

Power MOSFET

12 Amps, 60 Volts, Logic Level

N ? Channel DPAK

Designed for low voltage, high speed switching applications in

power supplies, converters and power motor controls and bridge

circuits.

http://onsemi.com

Features

? Lower R DS(on)

? Lower V DS(on)

? Tighter V SD Specification

? Lower Diode Reverse Recovery Time

? Lower Reverse Recovery Stored Charge

? AEC Q101 Qualified ? NTDV3055L104

? These Devices are Pb ? Free and are RoHS Compliant

Typical Applications

? Power Supplies

? Converters

? Power Motor Controls

? Bridge Circuits

MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)

V (BR)DSS

60 V

R DS(on) TYP

104 m W

N ? Channel

I D MAX

12 A

MARKING

DIAGRAMS

Rating

Drain ? to ? Source Voltage

Symbol

V DSS

Value

Unit

Vdc

Drain

Drain ? to ? Gate Voltage (R GS = 10 M W )

Gate ? to ? Source Voltage, Continuous

? Non ? Repetitive (t p v 10 ms)

Drain Current

? Continuous @ T A = 25 ° C

? Continuous @ T A = 100 ° C

? Single Pulse (t p v 10 m s)

Total Power Dissipation @ T A = 25 ° C

Derate above 25 ° C

Total Power Dissipation @ T A = 25 ° C (Note 1)

Total Power Dissipation @ T A = 25 ° C (Note 2)

Operating and Storage Temperature Range

V DGR

V GS

I D

I DM

P D

T J , T stg

" 15

" 20

0.32

2.1

1.5

? 55 to

+175

Vdc

Adc

Apk

W/ ° C

° C

1 2

DPAK

CASE 369C

STYLE 2

DPAK ? 3

CASE 369D

STYLE 2

Gate

Drain

Source

Single Pulse Drain ? to ? Source Avalanche E AS 61 mJ

Energy ? Starting T J = 25 ° C

(V DD = 25 Vdc, V GS = 5.0 Vdc, L = 1.0 mH

I L(pk) = 11 A, V DS = 60 Vdc)

Thermal Resistance, ? Junction ? to ? Case R q JC 3.13 ° C/W

? Junction ? to ? Ambient (Note 1) R q JA 71.4

? Junction ? to ? Ambient (Note 2) R q JA 100

Maximum Lead Temperature for Soldering T L 260 ° C

Purposes, 1/8 ″ from case for 10 seconds

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. When surface mounted to an FR4 board using 1 ″ pad size,

(Cu Area 1.127 in 2 ).

2. When surface mounted to an FR4 board using the minimum recommended

pad size, (Cu Area 0.412 in 2 ).

1 2 3

Gate Drain Source

55L104 = Device Code

Y = Year

WW = Work Week

G = Pb ? Free Package

ORDERING INFORMATION

See detailed ordering and shipping information in the package

dimensions section on page 3 of this data sheet.

? Semiconductor Components Industries, LLC, 2011

August, 2011 ? Rev. 8

Publication Order Number:

NTD3055L104/D

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